Nanoglow Scientific delivers hands-on technical consultancy grounded in deep expertise across Chemical Mechanical Planarization (CMP), wide-bandgap (WBG) and ultra-wide-bandgap (UWBG) semiconductor materials, and machine learning-driven process optimisation. Our team works as an embedded extension of your engineering group — bridging materials science, process engineering, and data analytics to solve your most demanding surface preparation challenges.
From SiC and GaN to emerging Ga₂O₃ substrates, we bring proven CMP knowledge to materials where standard recipes do not exist. We design slurry formulations, develop qualification protocols, and deploy AI models that cut development timelines from months to days.
Our consultancy engagements span the full wide-bandgap semiconductor value chain — wafer and substrate suppliers, power device manufacturers, automotive Tier-1 suppliers, module integrators, and university research groups. We have supported clients developing devices for electric vehicle powertrains, on-board chargers, industrial motor drives, and next-generation power electronics.
Engagements range from short-term process troubleshooting and product qualification to multi-month R&D partnerships and ongoing technical advisory roles. All work is conducted under strict NDA and IP protection agreements. Selected engagements, shared with client permission, are highlighted as case studies below.
Nanoglow Scientific is providing ongoing CMP process consultancy to Xtriod, a specialist wide-bandgap power device developer, supporting surface preparation for next-generation Ga₂O₃ and SiC power devices targeting electric vehicle applications.
Xtriod is a high-technology semiconductor company focused on ultra-wide-bandgap and wide-bandgap power devices for demanding automotive and industrial applications. Their product roadmap spans Ga₂O₃ power diodes, high-voltage SiC MOSFETs, high-voltage SiC power modules, and solid-state protection devices — targeting applications including traction inverters, HVAC compressors, on-board chargers (OBC), DC-DC converters, and battery management systems (BMS).
Ga₂O₃ (β-phase gallium oxide) presents a compelling opportunity: with a bandgap of ~4.9 eV — nearly 50% wider than SiC — it enables theoretically superior breakdown voltage and lower on-resistance for a given die area. However, Ga₂O₃ substrates pose acute CMP challenges:
For SiC, Xtriod's high-voltage MOSFET and module products require device-grade substrate surfaces with Ra < 0.2 nm and zero sub-surface damage — demanding far tighter process control than standard SiC polishing.
Designed and evaluated custom slurry formulations for β-Ga₂O₃ wafer polishing, selecting abrasive type, particle size distribution, oxidiser chemistry, and pH to balance removal rate with surface quality and SSD suppression.
Applied Bayesian optimisation and ML regression models trained on experimental data to map the multi-dimensional CMP parameter space for Ga₂O₃, identifying optimal pressure, velocity, and slurry flow conditions with a fraction of the experiments required by traditional DOE.
Provided process recipes and slurry qualification support for Xtriod's high-voltage SiC MOSFET and module substrates, targeting the high surface quality and zero-SSD requirements for automotive traction and OBC applications.
Guided Xtriod on substrate thinning strategies for Ga₂O₃ thermal management, informed by their thermal conductivity constraints, and provided recommendations for minimising oxygen vacancy-related defects during post-CMP handling.
Targeted expertise across the full CMP process lifecycle — from novel material qualification to yield improvement at scale.
End-to-end recipe development for novel and established substrates — SiC, GaN, Ga₂O₃, Si, and compound semiconductors. Slurry chemistry selection, pad matching, down-force and velocity optimisation, and conditioner strategy validated on your tool platform.
Deploy Bayesian optimisation and machine learning to intelligently navigate your process parameter space. Especially powerful for emerging materials like Ga₂O₃ where no established recipe baseline exists — achieving target surface finish with far fewer experiments.
Objective benchmarking of commercial and custom slurries against your device-grade surface requirements. Includes removal rate, Ra, defectivity, and cost-of-consumables analysis. Critical for SiC device grades from 650 V through high-voltage automotive classes.
Root-cause investigation of surface defects, scratches, sub-surface damage, and non-uniformity. Structured FMEA and corrective action planning to restore and sustain yield — with particular expertise in WBG material-specific failure modes.
Structured collaborative programmes bridging academic research and industrial deployment. We facilitate knowledge transfer, co-develop IP, and support scale-up from lab to pilot to HVM — including emerging UWBG materials such as Ga₂O₃ and diamond.
Independent assessment of CMP technology, IP portfolios, and process readiness for investors, acquirers, and strategic partners — providing clear, evidence-based technical reports on wide-bandgap semiconductor manufacturing capability.
A structured, collaborative engagement model designed to deliver measurable results quickly.
We begin with a confidential technical discussion to understand your process challenge, material system, device targets, timeline, and constraints. No obligation — just clarity on how we can help.
We present a focused proposal outlining deliverables, methodology, timeline, and commercial terms. Engagements are scoped tightly to your need — no overhead, no vague retainers.
Our engineers work hands-on with your team — on-site or remotely — conducting experiments, analysing data, and iterating rapidly. Regular progress updates keep you informed throughout.
Comprehensive technical reports, documented process recipes, and trained models are delivered with full IP assignment. A knowledge-transfer session ensures findings are embedded in your team.
Get in touch to arrange a confidential discovery call with our technical team.
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