Precisely engineered CMP slurries with optimised oxidising agents, corrosion inhibitors, stabilisers, and surfactants tailored to your specific wafer material system and process requirements.
Machine learning and Bayesian optimisation to find ideal CMP parameters �reducing development cycles from months to days while improving yield and reducing cost.
On-site demo centre with industry-standard Mirra® and Reflex® platforms. Validate slurry-on-tool performance at costs below £110�50 per SiC wafer.
Complete wafer processing workflow from slicing through CMP to final inspection.
Rough Polishing: NSAOS2412 with nonwoven pad �α-Al₂O�abrasive for high material removal rate.
Fine Polishing: NSSOS2411 with damping cloth pad �colloidal SiO�for sub-0.2nm surface finish.
Rinsing: Matched cleaning chemistry to ensure defect-free surfaces.
Our global application engineering and R&D teams deliver tailored solutions optimising your total cost of ownership.
Contact Us