Product Catalog

CMP Slurries & Abrasive Powders

A comprehensive portfolio addressing complex challenges across logic, memory, foundry, wafer substrate, and rigid disk substrate markets.

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CMP Slurries

The slurry is the most critical and expensive part of the CMP process and determines the selection of all other chemicals and equipment.

SiC Wafer CMP Slurries

SiC Wafer CMP Slurries

High-performance silicon carbide slurries for scalable manufacturing of low-defectivity power and semi-insulating SiC substrates. Optimised for Si-face, C-face, and poly-SiC wafers.

Ra < 0.2 nmNo Sub-surface DamageHVM Ready
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GaN / Nitride CMP Slurries

GaN / Nitride CMP Slurries

Innovative solutions for bulk polishing, lapping, and CMP of multiple nitride surfaces — GaN, AlGaN, AlN, Ga- or N-face, 'c' or 'm' planes.

Ultra-high MRRRa < 0.2 nmZero SSD
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Si Wafer CMP Slurries

Si Wafer CMP Slurries

Developed for prime polished wafers — highly refined, ultrapure crystalline silicon with ultra-flat, ultraclean surfaces customised to specifications.

Colloidal SiO₂/span>Ultra-pureCustomisable
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Quartz Glass Polishing Slurry

Quartz Glass Polishing Slurry

CeO₂ based polishing slurries for precision quartz glass finishing. Multiple particle size ranges for roughing and fine polishing stages.

CeO₂ Based800-1000nm100-200nm
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Micro-nano Alumina Powder

Micro-nano Alumina Powder

Semi-spherical α-Al₂O— with controllable particle size (D90 < 300nm). High-purity 3N, fully customisable for your CMP process.

100–1000 nm3N PurityCustomisable
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Micro-nano Ceria Powder

Micro-nano Ceria Powder

Semi-spherical CeO₂ from 30–7000nm. Up to 4N purity. Industry-leading removal rate and stability performance.

30–7000 nm3-4N PuritySuperior MRR
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Need a custom formulation?

Our application engineering team delivers tailored CMP solutions for your specific process requirements.

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