The slurry is the most critical and expensive part of the CMP process and determines the selection of all other chemicals and equipment.
High-performance silicon carbide slurries for scalable manufacturing of low-defectivity power and semi-insulating SiC substrates. Optimised for Si-face, C-face, and poly-SiC wafers.
Request QuoteInnovative solutions for bulk polishing, lapping, and CMP of multiple nitride surfaces �GaN, AlGaN, AlN, Ga- or N-face, 'c' or 'm' planes.
Request QuoteDeveloped for prime polished wafers �highly refined, ultrapure crystalline silicon with ultra-flat, ultraclean surfaces customised to specifications.
Request QuoteCeOâ‚?based polishing slurries for precision quartz glass finishing. Multiple particle size ranges for roughing and fine polishing stages.
Request QuoteSemi-spherical α-Al₂O�with controllable particle size (D90 < 300nm). High-purity 3N, fully customisable for your CMP process.
Request QuoteSemi-spherical CeO�from 30�000nm. Up to 4N purity. Industry-leading removal rate and stability performance.
Request QuoteComplete product line for rough and fine polishing stages of silicon carbide wafer processing.
| Model | Abrasive | Solid Content | Particle Size | pH | Pad | Removal Rate |
|---|---|---|---|---|---|---|
| NSAOS2412-A | α-Al₂O�/td> | 6�% | 100�00 nm | 9�0 | SUBA800 | 1.5� μm/h |
| NSAOS2412-B | �/td> | 5% | �/td> | 6� | SUBA800 | �/td> |
| NSSOS2411-A | Colloidal SiO�/td> | 38�2% | 100�20 nm | 9�0 | POLITEX | 0.2�.3 μm/h |
| NSSOS2411-B | �/td> | �/td> | �/td> | 10.5�2 | POLITEX | �/td> |
Full range of alumina and ceria powders with controllable particle sizes.
| Model | Product | Particle Size (nm) | Surface Area (m²/g) | Density (g/cm³) | Purity |
|---|---|---|---|---|---|
| NSAOP24110 | Alumina Powder | 800�000 | 3� | 1.6�.8 | 3N |
| NSAOP2415 | Alumina Powder | 400�00 | 5�0 | 1.6�.8 | 3N |
| NSAOP2412 | Alumina Powder | 100�00 | 5�0 | 1.6�.8 | 3N |
| NSCOP24110 | Ceria Powder | 1000�000 | 8�5 | 1.5�.7 | 3-4N |
| NSCOP2413 | Ceria Powder | 300�00 | 10�0 | 1.6�.7 | 3-4N |
| NSCOP24108 | Ceria Powder | 80�00 | 20�0 | 1.6�.7 | 3-4N |
| NSCOP24105 | Ceria Powder | 50�0 | 20�0 | 1.6�.8 | 3-4N |
| NSCOP24103 | Ceria Powder | 30�0 | 30�0 | 1.6�.8 | 3-4N |
| Model | Abrasive | Solid Content | Particle Size | pH | Dilution |
|---|---|---|---|---|---|
| NSSOS24108 | Colloidal SiO�/td> | 10�5% | 60�00 nm | 11�2 | 1:15 |
| NSSOS24103 | Colloidal SiO�/td> | 20�5% | 15�5 nm | 11�2 | 1:20 |
Our application engineering team delivers tailored CMP solutions for your specific process requirements.
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